ATL

1. Main Services

Microstructure analysis of materials / Metal structure analysis (grain size, pores) / Specific area cross-section analysis / Mineral analysis / Appearance evaluation

Scanning Electron Microscope (SEM): Magnification : 30 ~ 250,000x; Resolution : 5 nm; Detector : Secondary Electron (SEI), Back Scattered Electron (BSE); SDD Detector : Energy Dispersive X-ray Spectrometer (EDS)

Ion Sputter Coater: - Pretreatment equipment that coats Au/Pt thin film

2. Main Services

- Surface analysis, composition analysis, structure analysis, failure/defect analysis, and interpretation
- Reliability test analysis (automotive electronic component quality evaluation, electronic parts, and mechanical parts)
- Sample cutting, mounting, and polishing

Cutting Machine: - Cutting blade thicknes: 0.2 ~ 0.3 inch; - 0.5 t 이상의 PCB 보드나 작은 크기의 경도가 강한 소재의 절단; - RPM: 0 ~ 1200

Automatic Polisher: - RPM: 50 ~ 500; - Head RPM: 0 ~ 150

Manual Polisher: - RPM: 50 ~ 800; - Disk Paper: #120, #400, #600, #800, #1200, #2000, #2400, #3200, #4000; - Fine Polishing: 1 nm, 3 nm, 6nm

3. Main Services

Appearance evaluation, solder crack, damage, and dimension measurement

Optical microscope, stereomicroscope, electron microscope

4. X-ray

X-Ray Analysis Overview: X-ray analysis is a key quality evaluation technique that can inspect a product's internal structure, defects, foreign materials, cracks, and solder defects in a non-destructive manner.

Analysis Purposes: 1. Verification of internal conditions of solder areas such as BGA, CSP, and QFN; 2. Void analysis and solder defect detection; 3. Evaluation of cracks, foreign matter, and bonding conditions; 4. Inspection of mechanical part fastening status and internal structure; 5. Verification of short circuits/disconnections inside PCBs and electronic components

Application Targets: - Semiconductor packages (BGA, QFN, SOP, etc.); - SMT components; - Automotive electronic modules; - Industrial sensors/connectors; - Metal fastening components; - Secondary battery cells, tab welding parts, etc.

Analysis Services